The purpose of the TSMC University JDP is twofold- to develop talented graduate student for TSMC’s future recruitment and to fund strong science or engineering research that has the potential to make an impact on the future of the semiconductor industry.

2009 University JDP Plan

2009 Focus Areas of Interest
Cross discipline Principal Investigators (PIs) are welcome. Proposals of 1 year or up to 3 years in length in the following areas are solicited

1. Technologies of Logic, Materials & Fundamental, Specialty & Process related
• Transistors Structures Beyond 22nm (incl, Si, Ge, III-V)
• Advanced Memories (MRAM, PCRAM, RRAM etc..)
• MEMS, CMOS Sensors and Actuators
• Silicon Photonics
• Spintronics
• Organic Electronics
• High K dielectric synthesis
• Interface Engineering and Characterization: metals, insulators, and semiconductors
• Mott Transition
• Fundamental First-principle and Molecular Dynamic Simulations
• Fundamentals on Transport in Band-Engineered Materials
• Atomistic-Resolution Physical Analysis Techniques
• Fundamental transport of defect in alloy material systems
• Emphasis on the following aspects:
• Device Physics/ Characterization/ Models
• Device Reliability and Variability
• Novel Device structures and engineering
• Process Modules/Chemistry/Materials
• Nanoelectronics and Ab-initio computations
2. Design & Specialty Technology
• MM Wave
• RF and Analog Circuit Design
• High Speed
• Low power
• Emphasis on the following aspects:
• CAD and circuit models
• Design and test methodology
• Design for manufacturing
• Scalability of designs
• Active & passive device modeling
• Sensor electronics

Selection Process
Phase I- Written Proposal Review
Phase II- Final Presentation(PI & sponsor)

2009 Schedule

Call for proposal	now ~ 6/30/2009
Phase I	~ 7/10/2009
Phase II	7/20 ~7/30/2009
Announcement	8/5 ~ 8/10/2009
Contract/NDA signed	8/30/2009
Project starts	9/1/2009

Applications (please read this section carefully)
Submission
Two channels are available for the submission:

1. Fill up the “2009 TSMC University JDP Application Form” and return to Alex Wei, email:lhweib@tsmc.com.
2. On-line submission: submit your proposal on line  Application form  Submit proposal

Please note the deadline for submission is June 30, 2009 at the midnight. With regret, late submission will be declined.
  Once you complete on-line submission, you can’t revise the proposal on line. If you want to revised the submitted proposal, please send the revision to lhweib@tsmc.com directly.

Sponsor
Each project requires a TSMC SPONSOR who will be critical to the research in multiple folds:

1. Submit a pre-evaluation in terms of the 3 R’s as supporting materials to the Technical Board;
2. Facilitate the PI(s) to present the proposal to the Technical Board in the final selection;
3. Facilitate and provide necessary resources along the research;
4. Facilitate the PI(s) to present mid-term report (oral) and year-end (oral and paper) to the Technical Board

On condition that no sponsor is confirmed upon application, the Technical Board will invite related researcher to assume the role of SPONSOR. This invitation is on voluntary.

For any inquiry, please contact Alex Wei (魏烈恒) at lhweib@tsmc.com , Tel: (03) 563 6688 ext 707 5124
Submit proposal